Electrical Characteristics T J = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BV DSS
? BV DSS
? T J
I DSS
I GSS
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
I D = 250 μ A, V GS = 0 V
I D = 250 μ A, referenced to 25°C
V DS = 24 V, V GS = 0 V
V GS = ±20 V, V DS = 0 V
30
25
1
±100
V
mV / °C
μ A
nA
On Characteristics
V GS(th)
? V GS(th)
? T J
Gate to Source Threshold Voltage
Gate to Source Threshold Voltage
Temperature Coefficient
V GS = V DS , I D = 250 μ A
I D = 250 μ A, referenced to 25°C
1
1.9
-5
3
V
mV/°C
V GS = 10 V, I D = 6.3 A
21
25
r DS(on)
Static Drain to Source On Resistance
V GS = 4.5 V, I D = 5.5 A
26
33
m ?
V GS = 10 V, I D = 6.3 A, T J = 125°C
30
36
g FS
Forward Transconductance
V DS = 10 V, I D = 6.3 A
35
S
Dynamic Characteristics
C iss
C oss
C rss
R g
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
V DS = 15 V, V GS = 0 V,
f = 1MHz
470
100
60
3.0
620
130
90
pF
pF
pF
?
Switching Characteristics
t d(on)
Turn-On Delay Time
6
11
ns
t r
t d(off)
t f
Q g
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
V DD = 15 V, I D = 1 A,
V GS = 10 V, R GEN = 6 ?
V GS = 0 V to 10 V
2
15
2
9
10
26
10
13
ns
ns
ns
nC
Q g
Q gs
Total Gate Charge
Gate to Source Charge
V GS = 0 V to 5 V
V DD = 15 V,
I D = 6.3 A
5
1.4
7
nC
nC
Q gd
Gate to Drain “Miller” Charge
1.6
nC
Drain-Source Diode Characteristics
I S
Maximum Continuous Drain-Source Diode Forward Current
1.3
A
V SD
Source-Drain Diode Forward Voltage
V GS = 0 V, I S = 1.3 A
(Note 2)
0.8
1.2
V
t rr
Q rr
Reverse Recovery Time
Reverse Recovery Charge
I F = 6.3 A, di/dt = 100 A/ μ s
15
4
26
10
ns
nC
Notes:
1: R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.
R θ JC is guaranteed by design while R θ CA is determined by the user ’s board design.
a. 78 °C/W when mounted on a 1 in 2 pad of 2 oz copper on FR-4 board.
b. 156 °C/W when mounted on a minimum pad.
2: Pulse Test: Pulse Width<300 us, Duty Cycle<2.0%.
?2010 Fairchild Semiconductor Corporation
FDC655BN Rev . C2
2
www.fairchildsemi.com
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